Government Contract | Arkansas
Computerized FlipChip Bonder

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Bid Information

Bid Alert No: 00000543986

Bid Title: Computerized FlipChip Bonder

Agency Bid No. Title: 600685

Received Date: 04/14/2016

Close Date: 04/28/2016

Purchase Type: Not Stated

Delivery Point: University of Arkansas, Arkansas, 72207

Delivery Date: Not Stated


Specifications include, but are not limited to: Functional aspects of the accurate placement flip chip bonder: 1. Bonder to have a substrate module, chip module, tray holder, monitor and software for semi-, or automatic die placement. a. Bonder to have a 5m placement accuracy b. Bonder to have precision vacuum and sintering die bond capability. c. Bonder to have a process video module and die pick up module 2. Include a substrate module that can handle 100 x 100mm integrated board, a. Module to be able to heat up to 400oC with a ramp rate of 2oC/s. b. Module to have a 100x100mm vacuum enabled tray holder c. Module to be able to handle up to 100N of force from the chip bond head d. Process module configured for vacuum, inert and formic acid capability. 3. A chip module to handle 50 x 50mm die a. Module to be able to heat up to handle 400oC with a ramp rate of 10oC/s b. Equipped with an ultrasonic module of around 30W in power

Bid Related Documents

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Product Code: 49043

Agency Information

Issuing Agency: University of Arkansas

State: Arkansas

Agency Type: State and Local

Contact: Andy Fletcher, Purchasing Department Office of Business Affairs, 321 Administration Building, Fayetteville, Arkansas, 72701

Phone: 479-575-2551

Fax: 479-575-4158




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