Government Contract | Oregon
PECVD or ICP-CVD

Specifications include, but are not limited to: Deep Reactive Ion Etcher Required Specifications.Maximum substrate size: 6 (150mm diameter size).Load locked for faster exchange of samples between atmosphere and main chamber. We seek automated sample exchange between the load-lock and process chamber.2000 mm gate valve (or better) with Automatic pressure control for process chamber.5 kW or better Inductively Coupled Plasma Source with electrostatic shield for up to 6 wafers.1600 l/s or better Turbo molecular pump with backing dry pump.He backside cooling with mechanical clamping that can accommodate 2, 4 or 6 round wafers.PC control with software.Vacuum load lock with dry pump.Main chamber pump must also be a dry pump, rated for harsh applications. Vendors are encouraged to stick to one brand of pump for both chamber and load lock.Mass Flow controlled gas lines in a Sealable, purgeable and extractable stainless steel gas pod for the required gasses.Require vendor to demonstrate smallest in lab footprint options; ICP-CVD/PECVDRequired Specifications:Maximum substrate size: 6 (150mm diameter size).Load locked for faster exchange of samples between atmosphere and main chamber. We seek automated sample exchange between the load-lock and process chamber.A max operating temperature range of 500C in the main chamber.A high frequency (can be 13.56 Mhz or higher) for main plasma and a lower, adjustable RF frequency source for substrate bias. The tool must accommodate mixed frequency processing. Plasma source can be in a typical, showerhead type configuration or an ICP-coil assembly.Automatic pressure control for process chamber.Vacuum load lock with dry pump.Main chamber pump must also be a dry pump, rated for harsh applications. Vendors are encouraged to stick to one brand of pump for both chamber and load lock.End point detection for plasma cleaning of the chamber.Tunable film stress and optical properties of the deposited films.Sealable and extractable stainless steel gas pod for the required gasses.