Government Contract | Alabama
PCB DESIGN LAYOUT AND SOLDER ASSEMBLE

Bid Information


Bid Alert No: 00000403254

Bid Title: PCB DESIGN LAYOUT AND SOLDER ASSEMBLE

Agency Bid No. Title: B002387

Received Date: 12/16/2015

Close Date: 12/16/2015

Purchase Type: Not Stated

Delivery Point:

Delivery Date: Not Stated

Specifications

Specifications include, but are not limited to: PCB Design Layout and Solder Assemble SpecificationsLayout Requirements:1. Facilities for Printed Circuit (PC) board layout and PC board population/construction2. Must be local to facilitate layout process3. Experience with high density/fine pitch design layout (BGA, TSOP, etc.)4. Part placement equipment for various component form factors (BGA, TSOP, SOIC, SMD)5. Capable of multi-layer (10 layers) pc board layout with silkscreen6. Must have X-ray capability for BGA verification7. Must have In Circuit Test facility for board fabrication8. Dimension <10 x 10 x 0.0625, soldermask,9. Board thickness 0.0625, Copper thickness power planes 1 oz., Signed layers oz.10. Material FR-411. No Blind or buried vias.12. No fingers, no slots.13. Fiducials as required for parts placement.14. Capability to handle one-off runs15. UAH provide Gerber files. BOM will be provide for PCB board built.

Product Code: 92570

Agency Information


Issuing Agency: University of Alabama - Huntsville

State: Alabama

Agency Type: State and Local

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