Government Contract | District of Columbia
Guide Specifications for the Construction of Chip Seals and Microsurfacing

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Bid Information

Bid Alert No: 00000406568

Bid Title: Guide Specifications for the Construction of Chip Seals and Microsurfacing

Agency Bid No. Title: NCHRP 14-37

Received Date: 11/02/2015

Close Date: 12/15/2015

Purchase Type: 18 months

Delivery Point: Not Stated, District of Columbia

Delivery Date: Not Stated


Specifications include, but are not limited to: Task 1. Collect and review relevant domestic and foreign literature, research findings, and information relative to the construction of chip seals and microsurfacing. This information may be obtained from published and unpublished reports; survey of selected state and local agencies; and contacts with transportation agencies, industry, and other public and private organizations. Identify material of relevance to development of the guide specifications for further consideration in this research. Task 2. Prepare an updated, detailed work plan for Phase II that includes a process for developing separate guide specifications for (1) chip seals (cold and hot applied) and (2) microsurfacing. It is expected that the specifications will address practices applicable to different parts of the United States and the variety of materials used, methods of construction and quality assurance, methods of measurement and payment (including pay factors), and other relevant items

Bid Related Documents

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Product Codes: 91396, 91395

Agency Information

Issuing Agency: Transportation Research Board (TRB)

State: District of Columbia

Agency Type: State and Local

Contact: Amir N. Hanna The National Academies, 500 Fifth Street, NW, Washington, District of Columbia, 20001

Phone: 202-334-1432




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